JPH085814Y2 - Ledプリンタヘッド - Google Patents
LedプリンタヘッドInfo
- Publication number
- JPH085814Y2 JPH085814Y2 JP1988162537U JP16253788U JPH085814Y2 JP H085814 Y2 JPH085814 Y2 JP H085814Y2 JP 1988162537 U JP1988162537 U JP 1988162537U JP 16253788 U JP16253788 U JP 16253788U JP H085814 Y2 JPH085814 Y2 JP H085814Y2
- Authority
- JP
- Japan
- Prior art keywords
- light
- led
- rod lens
- printer head
- condensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003287 optical effect Effects 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Facsimile Heads (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988162537U JPH085814Y2 (ja) | 1988-12-15 | 1988-12-15 | Ledプリンタヘッド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988162537U JPH085814Y2 (ja) | 1988-12-15 | 1988-12-15 | Ledプリンタヘッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0282540U JPH0282540U (en]) | 1990-06-26 |
JPH085814Y2 true JPH085814Y2 (ja) | 1996-02-21 |
Family
ID=31446453
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988162537U Expired - Lifetime JPH085814Y2 (ja) | 1988-12-15 | 1988-12-15 | Ledプリンタヘッド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH085814Y2 (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101443925B (zh) * | 2006-04-04 | 2012-02-22 | 富士施乐株式会社 | 带有微透镜的发光元件阵列以及光写入头 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS612941U (ja) * | 1984-06-12 | 1986-01-09 | 日本信号株式会社 | 電子写真式印刷機の露光器 |
JPS61209176A (ja) * | 1985-03-13 | 1986-09-17 | Oki Electric Ind Co Ltd | 光プリントヘツド |
-
1988
- 1988-12-15 JP JP1988162537U patent/JPH085814Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0282540U (en]) | 1990-06-26 |
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